Polishing Machine Tender: A description for the polishing machine tender job
Machine Trades Jobs » Jobs In Machining Stone Clay Glass And Related Materials » Abrading Jobs 1 » Polishing Machine Tender
Polishing Machine Tender – Tends abrading machines that polish or lap surface of semiconductor wafers: Reads work order to determine specifications. Loads wafers or carriers containing wafers onto polishing or lapping machine. Adjusts machine controls or loads programmed control media in machine to regulate pressure, time, and slurry flow. Starts lapping machine that removes saw marks and reduces wafer thickness or starts polishing machine that polishes wafers. Observes machine operation and listens to sounds of belts, cams, and abrading wheel to detect machine malfunctions. Adjusts mechanisms or requests repairs as necessary. Stops machine at prescribed time, removes wafers from machine, and rinses wafers with water to cool wafers and remove slurry. Examines wafers for defects, and measures wafer thickness, using thickness gauge. May also clean wafers, using chemical solutions, water, or gases, to remove contaminants from wafer surface. May also mount wafers onto carriers. May also mix slurry. May also tend machine that rounds wafer edges and be designated Edge-Round Tender (electronic industry). May also be designated according to machine tended as Lapping Machine Tender (electronic industry).
Job industry: electronic industry
Other job descriptions:
Polishing Machine Tender
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